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Thermal transport properties of monolayer phosphorene: a mini-review of theoretical studies

Guangzhao QIN, Ming HU

Frontiers in Energy 2018, Volume 12, Issue 1,   Pages 87-96 doi: 10.1007/s11708-018-0513-y

Abstract: It is found that the (vdW) interactions play a key role in the formation of resonant bonding, whichTaking into account of the vdW interactions and including the long-ranged interactions caused by the resonantbonding with large cutoff distance are important for getting the accurate and converged thermal conductivityMoreover, a fundamental insight into the thermal transport is provided based on the review of resonantbonding in phosphorene.

Keywords： thermal transport     phosphorene     resonant bonding    

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The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Frontiers of Mechanical Engineering 2006, Volume 1, Issue 2,   Pages 238-241 doi: 10.1007/s11465-006-0011-5

Abstract: Electrostatic-alloy bonding of silicon wafer with glass deposited by Au to form Si/Au-glass water, andbonding of Si/Au-glass with silicon wafer were researched during fabrication of pressure sensors.then Si-Au alloy bonding was formed by annealing at 400vH for 2 h.The air sealability of the cavity after bonding was finally tested using the N filling method.The results indicate that large bond strength was obtained at the bonding interface.

Keywords： Si/Au-glass     strength     MEMS packaging     process     sandwich structure    

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Ultraviolet exposure enhanced silicon direct bonding

Guanglan LIAO, Xuekun ZHANG, Xiaohui LIN, Canghai MA, Lei NIE, Tielin SHI,

Frontiers of Mechanical Engineering 2010, Volume 5, Issue 1,   Pages 87-92 doi: 10.1007/s11465-009-0078-x

Abstract: the traditional wet chemical activation processes, is applied to enhance hydrophilic silicon direct bondingThe effects of UV exposure on silicon wafers’ nano-topography and bonding strength are studied.The correlations of annealing temperature and annealing time vs. bonding strength are experimentallyResults indicate that the bonding strength increases sharply then gently with increasing annealing temperatureIt follows from the results that the bonding strength of silicon wafer pairs with UV exposure decreases

Keywords： ultraviolet (UV) exposure     silicon direct bonding     bonding strength     reliability    

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Patterned wafer bonding using ultraviolet adhesive

Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI

Frontiers of Mechanical Engineering 2011, Volume 6, Issue 2,   Pages 214-218 doi: 10.1007/s11465-011-0130-5

Abstract:

The process of patterned wafer bonding using ultraviolet (UV) adhesive as the intermediate layer wasappropriate pre-drying temperature (60°C), and predrying time (6 min), we obtained the intermediate layer bondingExperimental results indicate that patterned wafer bonding using UV adhesive is achieved under room temperaturehas advantages of easy operation, low cost, and no plugging or leakage in the patterned area after bondingPatterned wafer bonding using UV adhesive will have great potential in the fabrication of microfluidic

Keywords： ultraviolet (UV) adhesive     intermediate layer     patterned wafer bonding    

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A space solar cell bonding robot

FU Zhuang, ZHAO Yan-zheng, LIU Ren-qiang, DONG Zhi

Frontiers of Mechanical Engineering 2006, Volume 1, Issue 3,   Pages 360-363 doi: 10.1007/s11465-006-0027-x

Abstract: A space solar cell bonding robot system which consists of a three-axis Cartesian coordinate s robot,coating device, bonding device, orientation plate, and control subsystem was studied.

Keywords： Cartesian coordinate     thickness     three-axis Cartesian     orientation     control subsystem    

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Damage mode and failure mechanism of starch based API gluelam bonding

Shi Junyou,Xu Wenbiao and Wang Shumin

Strategic Study of CAE 2014, Volume 16, Issue 4,   Pages 40-44

Abstract:

The starch- based aqueous polymer isocycante（API）gluelam bonding as theresearch object，with tensile shear strength as a key evaluation index，accelerated aging tests on gluelam bondingto study damage mode and failure mechanism of the bonding The results show that：the adhesive fractureproperties of ductile fracture structure，and with the increase of aging time，the damage mode of the bonding

Keywords： bonding structure     accelerated aging     fracture character     damage mode    

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High-bandwidth nanopositioning via active control of system resonance

Linlin LI, Sumeet S. APHALE, Limin ZHU

Frontiers of Mechanical Engineering 2021, Volume 16, Issue 2,   Pages 331-339 doi: 10.1007/s11465-020-0619-x

Abstract: almost all these cases, the achievable closed-loop bandwidth is still limited by the original open-loop resonantThe integral resonant control (IRC) has been reported earlier to demonstrate the significant performancefurther exploit the IRC scheme’s capabilities, this paper presents a method of actively shifting the resonant

Keywords： nanopositioning stage     high-bandwidth     resonant mode control     tracking control     integral resonant control    

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Flexible resonant tank for a combined converter to achieve an HPS and LED compatible driver

Jin HU,Hui-pin LIN,Zheng-yu LU,Feng-wu ZHOU

Frontiers of Information Technology & Electronic Engineering 2015, Volume 16, Issue 8,   Pages 679-693 doi: 10.1631/FITEE.1500054

Abstract: The proposed driver combines the LLC and LCC resonant circuits into a flexible resonant tank.The flexible resonant tank may change to LLC or isolated LCC circuit according to the lighting sourceThe design of the proposed flexible resonant tank considers the requirements of both HPS and LED.

Keywords： High pressure sodium (HPS)     Light emitting diode (LED)     Compatible driver     Ballast    

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Analysis of resonant coupling coil configurations of EV wireless charging system: a simulation study

M. LU, A. JUNUSSOV, M. BAGHERI

Frontiers in Energy 2020, Volume 14, Issue 1,   Pages 152-165 doi: 10.1007/s11708-019-0615-1

Abstract: This paper is focused on analyzing electromagnetically coupled resonant wireless technique used for theThe resonant wireless charging system for EVs is modeled, simulated, and then examined by changing different

Keywords： electromagnetically coupled resonator     near-field power transfer     wireless power transfer (WPT)    

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Towards Cr(VI)-free anodization of aluminum alloys for aerospace adhesive bonding applications: A review

Shoshan T. Abrahami, John M. M. de Kok, Herman Terryn, Johannes M. C. Mol

Frontiers of Chemical Science and Engineering 2017, Volume 11, Issue 3,   Pages 465-482 doi: 10.1007/s11705-017-1641-3

Abstract: For more than six decades, chromic acid anodizing (CAA) has been the central process in the surface pre-treatment of aluminum for adhesively bonded aircraft structures. Unfortunately, this electrolyte contains hexavalent chromium (Cr(VI)), a compound known for its toxicity and carcinogenic properties. To comply with the new strict international regulations, the Cr(VI)-era will soon have to come to an end. Anodizing aluminum in acid electrolytes produces a self-ordered porous oxide layer. Although different acids can be used to create this type of structure, the excellent adhesion and corrosion resistance that is currently achieved by the complete Cr(VI)-based process is not easily matched. This paper provides a critical overview and appraisal of proposed alternatives to CAA, including combinations of multiple anodizing steps, pre- and post anodizing treatments. The work is presented in terms of the modifications to the oxide properties, such as morphological features (e.g., pore size, barrier layer thickness) and surface chemistry, in order to evaluate the link between fundamental principles of adhesion and bond performance.

Keywords： aluminum     Cr(VI)-free     surface pre-treatments     anodizing     adhesive bonding    

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ARC welding method for bonding steel with aluminum

Zhenyang LU, Pengfei HUANG, Wenning GAO, Yan LI, Hanpeng ZHANG, Shuyan YIN

Frontiers of Mechanical Engineering 2009, Volume 4, Issue 2,   Pages 134-146 doi: 10.1007/s11465-009-0033-x

Abstract: When welding steel with aluminum, the appearance of intermetallic compounds of Fe and Al will decrease tenacity and increase rigidity, which leads to bad joint performance. A new type of low energy input (LEI) welding technology is introduced which can be used to weld steel with aluminum. Using the technology, brazing was located on the steel side and arc fusion welding on the aluminum side. The less heat input reduces the thickness of intermetallic compounds to 3-4 μm. Tensile strength tests prove that the joint breaks at the heat-affected zone and the strength is higher than 70% of the aluminum’s. Thus, the method can lead to a good performance joint.

Keywords： joining of steel and aluminum     low energy input welding     arc welding     fusion welding – brazing    

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Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology

Wang Weiyuan,Wang Yuelin

Strategic Study of CAE 2002, Volume 4, Issue 6,   Pages 56-62

Abstract: It is based on bulk silicon bonding technology and film sealed technology.The bulk silicon bonding technology includes electrostatic bonding, silicon direct bonding and interfaciallayer assisted bonding.

Keywords： packaging of MEMS     bulk silicon bonding technology     film-sealed technology    

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Hyperbranched magnetic polymer: highly efficient removal of Cr(VI) and application in electroplating wastewater

Frontiers of Chemical Science and Engineering 2023, Volume 17, Issue 10,   Pages 1568-1580 doi: 10.1007/s11705-023-2303-2

Abstract: By using a two-step hydrothermal method and trithiocyanuric acid (TTCA), 2,4,6-trihydrazino-1,3,5-triazine (THT), and Fe3O4 as raw materials, a spherical magnetic adsorbent polymer (TTCA/THT@Fe3O4) was synthesized to achieve the efficient removal of Cr(VI) from wastewater. Under optimal adsorption conditions, the maximum adsorption capacity of TTCA/THT@Fe3O4 for Cr(VI) can reach 1340 mg∙g‒1. Notably, the removal efficiency can approach 98.9%, even at the lower concentration of 20 mg∙L‒1 Cr(VI). For actual wastewater containing Cr(VI), the Cr(VI) concentration was reduced from 25.8 to 0.4 mg∙L‒1, a remarkable 20% lower than the current industry discharge standard value. A mechanism for the high adsorption performance of Cr(VI) on TTCA/THT@Fe3O4 was investigated using Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy, and density functional theory. It can be plausibly attributed to the formation of Cr/N and Cr/S coordination bonds. Additionally, surface electrostatic adsorption, reduction effects, and the spherical polymer structure increase the contact area with Cr(VI), maximizing adsorption. The synergistic effect of adsorption and reduction enhances the adsorption performance of TTCA/THT@Fe3O4 for Cr(VI) and total chromium in water. The resultant polymer has a simple preparation process, excellent adsorption performance, easy magnetic separation, and promising application for actual wastewater.

Keywords： magnetic polymer     chromium removal     hydrogen bonding     recyclability     actual wastewater    

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Design of ultrasonic elliptical vibration cutting system for tungsten heavy alloy

Frontiers of Mechanical Engineering 2022, Volume 17, Issue 4, doi: 10.1007/s11465-022-0715-1

Abstract: arrangement and working principle of piezoelectric transducers on the ultrasonic vibrator using the fifth resonantsupply is developed to excite the ultrasonic vibration unit, which makes the UEVC system present the resonant

Keywords： tungsten heavy alloy     ultrasonic elliptical vibration cutting     Timoshenko’s theory     resonant mode of    

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Performance of steel bridge deck pavement structure with ultra high performance concrete based on resin bonding

Frontiers of Structural and Civil Engineering 2021, Volume 15, Issue 4,   Pages 895-904 doi: 10.1007/s11709-021-0759-z

Abstract: The EP bonding layer can nearly double the drawing strength of the pavement interface from 1.3 MPa, and

Keywords： steel bridge deck pavement     ultra-high-performance concrete     epoxy resin     composite structure     bending fatigue performance    

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Title Author Date Type Operation

Thermal transport properties of monolayer phosphorene: a mini-review of theoretical studies

Guangzhao QIN, Ming HU

Journal Article

The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Journal Article

Ultraviolet exposure enhanced silicon direct bonding

Guanglan LIAO, Xuekun ZHANG, Xiaohui LIN, Canghai MA, Lei NIE, Tielin SHI,

Journal Article

Patterned wafer bonding using ultraviolet adhesive

Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI

Journal Article

A space solar cell bonding robot

FU Zhuang, ZHAO Yan-zheng, LIU Ren-qiang, DONG Zhi

Journal Article

Damage mode and failure mechanism of starch based API gluelam bonding

Shi Junyou,Xu Wenbiao and Wang Shumin

Journal Article

High-bandwidth nanopositioning via active control of system resonance

Linlin LI, Sumeet S. APHALE, Limin ZHU

Journal Article

Flexible resonant tank for a combined converter to achieve an HPS and LED compatible driver

Jin HU,Hui-pin LIN,Zheng-yu LU,Feng-wu ZHOU

Journal Article

Analysis of resonant coupling coil configurations of EV wireless charging system: a simulation study

M. LU, A. JUNUSSOV, M. BAGHERI

Journal Article

Towards Cr(VI)-free anodization of aluminum alloys for aerospace adhesive bonding applications: A review

Shoshan T. Abrahami, John M. M. de Kok, Herman Terryn, Johannes M. C. Mol

Journal Article

ARC welding method for bonding steel with aluminum

Zhenyang LU, Pengfei HUANG, Wenning GAO, Yan LI, Hanpeng ZHANG, Shuyan YIN

Journal Article

Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology

Wang Weiyuan,Wang Yuelin

Journal Article

Hyperbranched magnetic polymer: highly efficient removal of Cr(VI) and application in electroplating wastewater

Journal Article

Design of ultrasonic elliptical vibration cutting system for tungsten heavy alloy

Journal Article

Performance of steel bridge deck pavement structure with ultra high performance concrete based on resin bonding

Journal Article